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Table 1 Metal removal from Sn–Cu–Ag (100 mg) and Sn–Cu (100 mg) solder by 10 ml acetic acid (100%) in 24 h at 150 rpm and 30 °C

From: Acetic acid mediated leaching of metals from lead-free solders

Sr. no. Solder type Metal extraction (%)
Cu Ag Sn
1 Sn–Cu–Ag 38.10 (± 0.22) 37.90 (± 0.09) 40 (± 1.00)
2 Sn–Cu 54.00 (± 0.15) 61.20 (± 0.95)
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