Table 1 Metal removal from Sn–Cu–Ag (100 mg) and Sn–Cu (100 mg) solder by 10 ml acetic acid (100%) in 24 h at 150 rpm and 30 °C
From: Acetic acid mediated leaching of metals from lead-free solders
Sr. no. | Solder type | Metal extraction (%) | ||
|---|---|---|---|---|
Cu | Ag | Sn | ||
1 | Sn–Cu–Ag | 38.10 (± 0.22) | 37.90 (± 0.09) | 40 (± 1.00) |
2 | Sn–Cu | 54.00 (± 0.15) | – | 61.20 (± 0.95) |