Table 2 Comparison of present study with existing literature
From: Acetic acid mediated leaching of metals from lead-free solders
Sr. no. | Solder type | Lixiviant used | Concentration of lixiviant | Amount of solder used (g/L) | Temperature (°C) | Amount of metals recovered (%) | Time required (h) | References |
|---|---|---|---|---|---|---|---|---|
1 | Sn–Cu | Acetic acid | 80% | 25 | 30 | 100 | 30 | Present study |
2 | Sn–Cu | A. niger culture supernatant containing citric acid | 20 g/l | 5 | 30 | 100 | 96 | Hocheng et al. (2014) |
3 | Sn–Cu–Ag | A. niger culture supernatant containing citric acid | 20 g/l | 5 | 30 | 100 | 48 | Hocheng et al. (2014) |
4 | Sn–Cu–Ag | Nitric acid | 2 M | 100 | 75 | 100 | 2 | Yoo et al. (2012) |