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Table 2 Comparison of present study with existing literature

From: Acetic acid mediated leaching of metals from lead-free solders

Sr. no. Solder type Lixiviant used Concentration of lixiviant Amount of solder used (g/L) Temperature (°C) Amount of metals recovered (%) Time required (h) References
1 Sn–Cu Acetic acid 80% 25 30 100 30 Present study
2 Sn–Cu A. niger culture supernatant containing citric acid 20 g/l 5 30 100 96 Hocheng et al. (2014)
3 Sn–Cu–Ag A. niger culture supernatant containing citric acid 20 g/l 5 30 100 48 Hocheng et al. (2014)
4 Sn–Cu–Ag Nitric acid 2 M 100 75 100 2 Yoo et al. (2012)
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